Power Integrity Modeling and Design for Semiconductors and Systems

Power Integrity Modeling and Design for Semiconductors and Systems cover

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Author: Author

Pages: 496

Size: 2.790,17 Kb

Publication Date: November 29,2007

Category: Semiconductors



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The First In depth, Example-Rich Instruction to Power Integrity Modeling

Experts such as for example signal integrity engineers, package designers, and system architects have to thoroughly understand signal and power integrity issues to be able to successfully design packages and boards for high speed systems.

Using reasonable case research and downloadable software good examples, two leading specialists demonstrate today's system-level concentrate and practical examples can make it indispensable for each and every pupil and professional worried about power integrity, including electrical engineers, system designers, transmission integrity engineers, and components scientists. Right now, for the very first time, there's best approaches for developing and modeling interconnects to effectively distribute power and minimize sound. It will be valuable to designers building software that really helps to evaluate high-rate systems. Their many good examples add the simplest (using analytical equations to compute power noise) through complicated system-level applications.

The authors

  • Introduce power delivery network components, evaluation, high-rate of recurrence measurement, and modeling requirements
  • Thoroughly describe modeling of power/floor planes, which includes plane behavior, lumped modeling, distributed circuit-based approaches, plus much more
  • Offer in-depth insurance of simultaneous switching sound, including modeling for come back currents using period- and frequency-domain evaluation
  • Introduce a number of leading time-domain simulation strategies, such as for example macromodeling, and talk about their benefits and drawbacks
  • Present the use of the modeling strategies on many advanced case research that include high-quickness servers, high-velocity differential signaling, chip bundle analysis, components characterization, embedded decoupling capacitors, and electromagnetic bandgap structures

This reserve's a total instruction to power integrity modeling: all you need to understand, from the fundamentals through the condition of the artwork.

The authors thoroughly introduce the core principles of power distribution style, systematically present and evaluate leading approaches for modeling sound, and link these ways to specific applications.



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